The process exploits mass transport associated with solid-state ionic conductors to create a high-throughput stamping or imprinting process.

In this process, a ‘stamp’ made of a solid state ionic conductor is brought in contact with the substrate to be patterned. With the correct polarity, metal at the interface is dissolved into the stamp and deposited at the counter electrode. This eliminates the need for a wet environment and provides high throughput and excellent transfer fidelity.